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Will produce world’s first high reliability ultra-thin packaged ICs.
February 19, 2019
By: DAVID SAVASTANO
Editor, Ink World Magazine
HD MicroSystems (HDM) and American Semiconductor, Inc. (ASI) announced the establishment of a joint development agreement to drive the adoption of ultra-thin chip packaging technology for both traditional rigid and emerging flexible electronics markets. The joint development will leverage American Semiconductor’s patented wafer-level chip scale packaging technologies that are encapsulated with advanced polyimide materials provided by HD MicroSystems. “We are honored to collaborate with...
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